ChongMing Group (HK) Int'l Co., Ltd
CHONGMING GROUP (HK) INT'L CO., LTD.
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MOC3052 Electronics Components 6 Pin DIP Random Phase Optoisolators Triac Drivers
The MOC3051 Series consists of a GaAs infrared LED optically coupled to a non–Zero–crossing silicon bilateral AC switch (triac). The MOC3051 Series isolates low voltage logic from 115 and 240 Vac lines to provide random phase control of high current triacs or thyristors. The MOC3051 Series features greatly enhanced static dv/dt capability to ensure stable switching performance of inductive loads.
Recommended for 115/240 Vac(rms) Applications:
• Solenoid/Valve Controls
• Solid State Relays
• Lamp Ballasts
• Incandescent Lamp Dimmers
• Static AC Power Switch
• Temperature Controls
• Interfacing Microprocessors to 115 and 240 Vac
• Motor Controls Peripherals
MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
| Rating | Symbol | Value | Unit |
| INFRARED EMITTING DIODE | |||
| Reverse Voltage | VR | 3 | Volts |
| Forward Current — Continuous | IF | 60 | mA |
| Total Power Dissipation @ TA = 25°C Negligible Power in Triac Driver Derate above 25°C | PD | 100
1.33 | mW
mW/°C |
| OUTPUT DRIVER | |||
| Off–State Output Terminal Voltage | VDRM | 600 | Volts |
| Peak Repetitive Surge Current (PW = 100 µs, 120 pps) | ITSM | 1 | A |
| Total Power Dissipation @ TA = 25°C Derate above 25°C | PD | 300 4 | mW mW/°C |
| TOTAL DEVICE | |||
| Isolation Surge Voltage (1) (Peak ac Voltage, 60 Hz, 1 Second Duration) | VISO | 7500 | Vac(pk) |
| Total Power Dissipation @ TA = 25°C Derate above 25°C | PD | 330 4.4 | mW mW/°C |
| Junction Temperature Range | TJ | –40 to +100 | °C |
| Ambient Operating Temperature Range (2) | TA | –40 to +85 | °C |
| Storage Temperature Range(2) | Tstg | –40 to +150 | °C |
| Soldering Temperature (10 s) | TL | 260 | °C |
1. Isolation surge voltage, VISO, is an internal device dielectric breakdown rating. 1. For this test, Pins 1 and 2 are common, and Pins 4, 5 and 6 are common.
2. Refer to Quality and Reliability Section in Opto Data Book for information on test conditions.
PACKAGE DIMENSIONS