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P82B96DR Programmable Logic ICS Image Sensors 3D time-of-flight (ToF) sensor and controller 56-COG 0 to 70
1 Features
Can Interface Between I2C Buses Operating at Different Logic Levels (2 V to 15 V)
Longer Cables by allowing bus capacitance of 400 pF on Main Side (Sx/Sy) and 4000 pF on Transmission Side (Tx/Ty)
Outputs on the Transmission Side (Tx/Ty) Have High Current Sink Capability for Driving Low- Impedance or High-Capacitive Buses
Interface With Optoelectrical Isolators and Similar Devices That Need Unidirectional Input and Output Signal Paths by Splitting I2C Bus Signals Into Pairs of Forward (Tx/Ty) and Reverse (Rx/Ry) Signals
400-kHz Fast I2C Bus Operation Over at Least 20 Meters of Wire
Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
ESD Protection Exceeds JESD 22
2 Applications
HDMI DDC
Long I2C Communication
Galvanic I2C Isolation
Industrial Communications
3 Description
The P82B96 device is a bus buffer that supports bidirectional data transfer between an I2C bus and a range of other bus configurations with different voltage and current levels.
One of the advantages of the P82B96 is that it supports longer cables/traces and allows for more devices per I2C bus because it can isolate bus capacitance such that the total loading (devices and trace leCM GROUPhs) of the new bus or remote I2C nodes are not apparent to other I2C buses (or nodes). The restrictions on the number of I2C devices in a system due to capacitance, or the physical separation between them, are greatly improved.
The device is able to provide galvanic isolation (optocoupling) or use balanced transmission lines (twisted pairs), because separate directional Tx and Rx signals are provided. The Tx and Rx signals may be connected directly (without causing bus latching), to provide an bidirectional signal line with I2C properties (open-drain driver). Likewise, the Ty and Ry signals may also be connected together to provide an bidirectional signal line with I2C properties (open- drain driver). This allows for a simple communication design, saving design time and costs.
Device Information
PART NUMBER |
PACKAGE |
BODY SIZE (NOM) |
P82B96 |
SOIC (8) |
4.90 mm × 3.91 mm |
VSSOP (8) |
3.00 mm × 3.00 mm |
|
PDIP (8) |
9.81 mm × 6.35 mm |
|
TSSOP (8) |
3.00 mm × 4.40 mm |