ChongMing Group (HK) Int'l Co., Ltd

CHONGMING GROUP (HK) INT'L CO., LTD.

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6D MEMS Sensor Modules Integrated Circuit Chip With 3D Gyroscope / 3D Accelerometer LSM6DS3TR

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ChongMing Group (HK) Int'l Co., Ltd
City:shenzhen
Country/Region:china
Contact Person:MsDoris Guo
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6D MEMS Sensor Modules Integrated Circuit Chip With 3D Gyroscope / 3D Accelerometer LSM6DS3TR

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Brand Name :ST
Model Number :LSM6DS3TR
Certification :ROHS
Place of Origin :Original & New
MOQ :10pcs
Price :Negotiate
Payment Terms :T/T, Western Union, Paypal
Supply Ability :10000pcs
Delivery Time :1-3Days
Packaging Details :BOX
Description :Accelerometer, Gyroscope, Temperature, 6 Axis Sensor I²C, SPI Output
Series :6D MEMS sensor modules
Package :LGA-14
Feature :3D gyroscope, 3D accelerometer
Application :6D orientation detection
D/c :New & Original Allegro Only
Lead time :0-3 Days
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LSM6DS3TR LGA-14 3D gyroscope, 3D accelerometer 6D MEMS sensor modules

Description

The LSM6DS3 is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope performing at 1.25 mA (up to 1.6 kHz ODR) in highperformance mode and enabling always-on low-power features for an optimal motion experience for the consumer.

FEATURES and BENEFITS

 Power consumption: 0.9 mA in combo normal mode and 1.25 mA in combo high-performance mode up to 1.6 kHz.
 “Always-on” experience with low power consumption for both accelerometer and gyroscope
 Smart FIFO up to 8 kbyte based on features set
 Compliant with Android K and L
 Hard, soft ironing for external magnetic sensor corrections
 ±2/±4/±8/±16 g full scale
 ±125/±250/±500/±1000/±2000 dps full scale
 Analog supply voltage: 1.71 V to 3.6 V
 Independent IOs supply (1.62 V)
 Compact footprint, 2.5 mm x 3 mm x 0.83 mm
 SPI/I2C serial interface with main processor data synchronization feature
 Embedded temperature sensor
 ECOPACK®, RoHS and “Green” compliant

Typical applications

 Pedometer, step detector and step counter
 Significant motion and tilt functions
 Indoor navigation
 Tap and double-tap detection
 IoT and connected devices
 Intelligent power saving for handheld devices
 Vibration monitoring and compensation
 Free-fall detection
 6D orientation detection

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