ChongMing Group (HK) Int'l Co., Ltd
CHONGMING GROUP (HK) INT'L CO., LTD.
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| 2SD1408Y | 3000 | TOSHIBA | 16+ | TO-220F |
| 10TPB47M | 9000 | SANYO | 16+ | SMD |
| F931A106MAA | 1950 | NICHILON | 14+ | SMD |
| AM26LS32ACNSR | 1600 | TI | 13+ | SOP-16 |
| 10TPC68M | 9000 | SANYO | 15+ | SMD |
| 10TPB33M | 9000 | SANYO | 15+ | SMD |
| A6251M | 5800 | SANKEN | 11+ | DIP-8 |
| A6251M | 2230 | SANKEN | 16+ | DIP-8 |
| H1061 | 3460 | HIT | 14+ | TO-220 |
| XC5CSX95T-2FF1136I | 100 | XILINX | 15+ | BGA |
| FSDM0265RN | 3460 | FAIRCHILD | 16+ | DIP-8 |
| MOC3083 | 5588 | FSC | 16+ | DIP |
| GP1A52HRJ00F | 3460 | SHARP | 15+ | DIP |
| PIC24FJ128GB106-I/PT | 4173 | MICROCHIP | 15+ | TQFP |
| C393C | 1380 | NEC | 16+ | DIP-8 |
| DS1220AD-100IND+ | 500 | DALLAS | 15+ | DIP-24 |
| ME15N10-G | 5956 | MATSU | 16+ | TO-252 |
| D3SB60 | 2200 | SHINDENGE | 14+ | TO-220 |
| FT2232D | 3460 | FTDI | 14+ | QFP |
| BCV49 | 8000 | INF | 16+ | SOT-89 |
| 2SA1941+2SC5198 | 3000 | TOSHIBA | 16+ | TO-3P |
| LM5010SD | 1942 | NSC | 14+ | LLP-10 |
| LM3916N-1 | 2134 | NSC | 11+ | DIP-8 |
| L9823 | 2949 | ST | 15+ | SOP24 |
| XC95216-20PQ160I | 480 | XILINX | 12+ | QFP-160 |
| 74HC14D | 7500 | 16+ | SOP | |
| DM-58 | 7740 | NMB | 13+ | SIP |
| LA4629 | 2652 | SANYO | 14+ | ZIP-12 |
| BFP183E6359 | 2100 | 15+ | SMD | |
| BAS70-04LT1G | 15000 | ON | 15+ | SOT-23 |
| BAS70-05LT1G | 15000 | ON | 15+ | SOT-23 |
| HEF4050BT | 1520 | 15+ | SOP | |
| EP1K30TC144-3 | 2370 | ALTERA | 16+ | TQFP144 |
| MCR265-10 | 5782 | ON | 16+ | TO-220 |
| GBPC3508W | 3460 | SEP | 13+ | GBPC |
Features and Benefits
• Low On-Resistance
• Low Input Capacitance
• Fast Switching Speed
• Lead Free By Design/RoHS Compliant (Note 1)
• "Green" Device (Note 2)
• Qualified to AEC-Q101 standards for High Reliability
Mechanical Data
• Case: SOT-23
• Case Material: Molded Plastic, "Green" Molding Compound. UL Flammability Classification Rating 94V-0 • Moisture Sensitivity: Level 1 per J-STD-020
• Terminal Connections Indicator: See diagram
• Terminals: Finish ⎯ Matte Tin annealed over Copper leadframe. Solderable per MIL-STD-202,
Method 208
• Weight: 0.08 grams (approximate