ChongMing Group (HK) Int'l Co., Ltd
CHONGMING GROUP (HK) INT'L CO., LTD.
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| NC7SZ04M5X | 5000 | FAIRCHILD | 15+ | SOT23-5 |
| PCA82C251 | 5000 | 12+ | SOP-8 | |
| PZTA42T1G | 5000 | ON | 16+ | SOT223 |
| RBV5006 | 5000 | EIC | 12+ | RBV-4 |
| RUEF250 | 5000 | RAYCHEM | 16+ | DIP |
| ST3232ECDR | 5000 | ST | 16+ | SOP-16 |
| SW-289 | 5000 | MA/COM | 16+ | SOP14 |
| TL072CDR | 5000 | TI | 16+ | SOP8 |
| TL7705BCP | 5000 | TI | 16+ | SOP8 |
| TPS2041BDBVR | 5000 | TI | 14+ | SOT23-5 |
| TPS5430DDAR | 5000 | TI | 16+ | SOP8 |
| UCLAMP0511P TCT | 5000 | SEMTECH | 16+ | MICREL |
| ULN2003ADRG3 | 5000 | TI | 15+ | SOP16 |
| SN75C1406N | 5002 | TI | 16+ | SOP-16 |
| B340A-13-F | 5008 | DOIDES | 15+ | SMA |
| REG1117-3.3 | 5008 | BB | 12+ | SOT223 |
| SST25VF032B-80-4I-S2AF | 5010 | SST | 16+ | SOP8 |
| TPS79730DCKR | 5018 | TI | 12+ | SC70-5 |
| 2SC3355 | 5100 | NEC | 16+ | TO-92 |
| DAC0808LCN | 5100 | NSC | 16+ | DIP16 |
| FDS4435 | 5100 | FAIRCHILD | 16+ | SOP-8 |
| LT1963EST-2.5 | 5100 | LT | 16+ | SOT-223 |
| X5045P | 5100 | XICOR | 16+ | DIP8 |
| DAC7554IDGS | 5110 | TI | 14+ | MSOP-10 |
| AM26LV32IDR | 5120 | TI | 16+ | SOP16 |
| CS51412EDR8G | 5120 | ON | 16+ | SOP8 |
| LM2940T-12 | 5120 | NS | 15+ | TO-220 |
| LM6132BIMX | 5120 | NS | 16+ | SOP8 |
| RC5057M | 5120 | FAIRCHILD | 15+ | SOP16 |
| SN75ALS180DR | 5120 | TI | 12+ | SOP-14 |
| UGN3503UA | 5120 | ALLEGRO | 16+ | TO-92 |
| BD241C | 5123 | FSC | 12+ | TO-220 |
FEATURES
• P-Channel
• Surface Mount (IRFR9214/SiHFR9214)
• Straight Lead (IRFU9214/SiHFU9214)
• Advanced Process Technology
• Fast Switching
• Fully Avalanche Rated
• Lead (Pb)-free Available
DESCRIPTION
Third generation Power MOSFETs from Vishay utilize advanced processing techniques to achieve low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications. The DPAK is designed for surface mounting using vapor phase, infrared, or wave soldering techniques. The straight lead version (IRFU/SiHFU series) is for through-hole mounting
applications. Power dissipation levels up to 1.5 W
are possible in typical surface mount applications.