ChongMing Group (HK) Int'l Co., Ltd
CHONGMING GROUP (HK) INT'L CO., LTD.
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HEXFET Power MOSFET
| VDSS | RDS(on) max | ID |
| 200V | 0.082Ω | 31A |
Applications
Benefits
Absolute Maximum Ratings
| Parameter | Max. | Unit | |
| ID @ TC = 25°C | Continuous Drain Current, VGS @ 10V | 31 | A |
| ID @ TC = 100°C | Continuous Drain Current, VGS @ 10V | 21 | A |
| IDM | Pulsed Drain Current | 124 | A |
| PD @TA = 25°C | Power Dissipation | 3.1 | W |
| PD @TC = 25°C | Power Dissipation | 200 | W |
| Linear Derating Factor | 1.3 | W/°C | |
| VGS | Gate-to-Source Voltage | ± 30 | V |
| dv/dt | Peak Diode Recovery dv/dt | 2.1 | V/ns |
|
TJ TSTG |
Operating Junction and Storage Temperature Range |
-55 to + 175 | °C |
| Soldering Temperature, for 10 seconds | 300 (1.6mm from case ) | °C | |
| Mounting torque, 6-32 or M3 srew | 10 lbf•in (1.1N•m) |
Stock Offer (Hot Sell)
| Part NO. | Q'ty | MFG | D/C | Package |
| MAX1636EAP-T | 6200 | MAXIM | 10+ | SSOP |
| MAC8M | 9873 | ON | 10+ | TO-220 |
| MJD117-1G | 8000 | ON | 14+ | TO-263 |
| MAX1683EUK+T | 6350 | MAXIM | 16+ | SOT |
| L3G4200D | 2729 | ST | 15+ | LGA16 |
| PTN78020AAH | 400 | TI | 15+ | DIP |
| MAX4214EUK+T | 5968 | MAXIM | 10+ | SOT |
| MX25L12873FM2I-10G | 4500 | MXIC | 15+ | SOP |
| ATTINY10-TSHR | 3000 | ATMEL | 15+ | SOT23 |
| PTN78060WAD | 980 | TI | 15+ | DIP |
| PIC18F2520-I/SO | 4598 | MICROCHIP | 15+ | SOP |
| MC33269DR2-5.0 | 4554 | ON | 15+ | SOP |
| MCP3421AOT-E/CH | 5302 | MICROCHIP | 16+ | SOT |
| MMBFJ108 | 10000 | FAIRCHILD | 16+ | SOT-23 |
| PIC18F8520-I/PT | 4273 | MICROCHIP | 14+ | TQFP |
| PIC18F4550-I/PT | 4438 | MICROCHIP | 14+ | QFP |
| MC68HC908QY4CPE | 3832 | FREESCALE | 14+ | DIP |
| ZTX751 | 16060 | ZETEX | 11+ | TO-92 |
| MC9S12C64MFAE | 4732 | FREESCALE | 14+ | QFP |
| ZTX651 | 29000 | ZETEX | 11+ | TO-92 |
| LTC1650AIS | 2802 | LINEAR | 11+ | SOP |