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Features
■ Core: ARM 32-bit Cortex™-M3 CPU
– 72 MHz maximum frequency, 1.25 DMIPS/MHz (Dhrystone 2.1)
performance at 0 wait state memory access
– Single-cycle multiplication and hardware division
■ Memories
– 256 to 512 Kbytes of Flash memory
– up to 64 Kbytes of SRAM
– Flexible static memory controller with 4 Chip Select.
Supports Compact Flash, SRAM, PSRAM, NOR and NAND memories
– LCD parallel interface, 8080/6800 modes
■ Clock, reset and supply management
– 2.0 to 3.6 V application supply and I/Os
– POR, PDR, and programmable voltage detector (PVD)
– 4-to-16 MHz crystal oscillator
– Internal 8 MHz factory-trimmed RC
– Internal 40 kHz RC with calibration
– 32 kHz oscillator for RTC with calibration
Description
The STM32F103xC, STM32F103xD and STM32F103xE performance line family incorporates the high-performance ARM® Cortex™-M3 32-bit RISC core operating at a 72 MHz frequency, high-speed embedded memories (Flash memory up to 512 Kbytes and SRAM up to 64 Kbytes), and an extensive range of enhanced I/Os and peripherals connected to two APB buses. All devices offer three 12-bit ADCs, four general-purpose 16- bit timers plus two PWM timers, as well as standard and advanced communication interfaces: up to two I2Cs, three SPIs, two I2Ss, one SDIO, five USARTs, an USB and a CAN.
The STM32F103xx high-density performance line family operates in the –40 to +105 °C temperature range, from a 2.0 to 3.6 V power supply. A comprehensive set of power-saving mode allows the design of low-power applications.
These features make the STM32F103xx high-density performance line microcontroller family suitable for a wide range of applications such as motor drives, application control, medical and handheld equipment, PC and gaming peripherals, GPS platforms, industrial applications, PLCs, inverters, printers, scanners, alarm systems video intercom, and HVAC.
Typical current consumption on VBAT with RTC on vs. temperature at different VBAT values
STOCK LIST
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PCA9515ADP | 12080 | 16+ | MSOP | |
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