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SN5407, SN5417, SN7407, SN7417
HEX BUFFERS/DRIVERS WITH OPEN-COLLECTOR HIGH-VOLTAGE OUTPUTS
description
These TTL hex buffers/drivers feature high-voltage open-collector outputs for interfacing with high-level circuits (such as MOS) or for driving high-current loads (such as lamps or relays) and also are characterized for use as buffers for driving TTL inputs. The SN5407 and SN7407 have minimum breakdown voltages of 30 V, and the SN5417 and SN7417 have minimum breakdown voltages of 15 V. The maximum sink current is 30 mA for the SN5407 and SN5417 and 40 mA for the SN7407 and SN7417.
These devices perform the Boolean function Y = A in positive logic.
These circuits are completely compatible with most TTL families. Inputs are diode clamped to minimize transmission-line effects, which simplifies design. Typical power dissipation is 145 mW, and average propagation delay time is 14 ns.
absolute maximum ratings over operating free-air temperature (unless otherwise noted)†
Supply voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Input voltage, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5 V
Output voltage, VO (see Notes 1 and 2): SN5407, SN7407 . . . . . . . . . . . . . . . . . . . . . . . . . 30 V
SN5417, SN7417 . . . . . . . . . . . . . . . . . . . . . . . . . 15 V
Package thermal impedance, θJA (see Note 3): D package . . . . . . . . . . . . . . . . . . . . . . . 86°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . 80°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . 76°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES:
1. All voltage values are with respect to GND.
2. This is the maximum voltage that should be applied to any output when it is in the off state.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
logic diagram, each buffer/driver (positive logic)
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